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SGA-310B+C
Abatement Type
SGA-310B+C
Scrubber Type
Wet-Thermal-Wet
Dimensions (mm)
950W* 950D*1970H(mm)
Weight
785kg
Total Flow Rate
800LPM
Temperature (For Processing Gas)
700~850ºC
Max. No. of Inlet Ports
Up to 4
Inlet Port Type (Option)
ISO80
Outlet Port Type
1 x ISO100

Application & DRE:
Waste gas abatement in processes such as  LP and PE-CVD; abatement of
PFC gases. Target abatement gas:
1.Flammable gases : SiH4>99% , PH3 >99% , DCS(SiH2Cl2)>99%, TEOS>99% ,
 GeH4>99% ,H2>99%, etc
2.Water soluble gases : Cl2, HCl>99% , HF>99% , NH3 >99% , etc
3.PFCs : NF3 >95% (SGA-310A不適用於有NF3製程,請選擇SGA-310BSU/
SGA-310B/1000K/2000K/3000K)
4. Toxic gases: B2H6>99%  SiH2Cl2>99% TEOS>99% WF6>99% GeH4>99%
 TEPO>99%  TEB>99% TMA>99%    N2O  C2F6  C3F8
ClF3>99%,CF4,SiF4,Ar,CH4SiCl4, SiCl4,Si2H6, Si2H6,He,C2H4,PH2, CH3SiH3,
TDMAT, PDMAT, TMP,TMB,3MS(C3H10Si), OMCTS,4MS, N2,AsH3, TCS,  VOCs,
DMA,F2,LTO520,F2H2,CxFy,HBr,BCl3,CO,SF6,SiCl4,ClF3
H2O2,Boron Trichloride  , Hydrogen Bromide, Phosphine ,Arsine , AP-LTN630,
SiH3Cl,C6H18OSi2(HMDSO)
清潔氣體:PH3

Process:
Solar 、Thin Film、Etching 、Diffusion
Integrating thermal oxidation with dynamic oxidation provides a safe,
efficient and low cost effective abatement solution for toxic, flammable
and global warming gases used extensively in Semiconductor, Photovoltaic
 ,Solar and Thin Film Solar manufacturing processes.
Point of use treatment specifically designed for treating fluorine-generating
 NF3 chamber clean effluent from 200 mm CVD process tools without the
use of fuel. The IPI is effective for flammable,pyrophoric,corrosive and
 particulate-generating process gases.
半導體CVD製程,Diffusion製程:同一系列不同型號產品同樣適用於結晶型太陽能
電池PECVD製程
電熱水洗式廢氣處理機為一臺專門處理各種製程廢氣的系統,它混合了熱氧化分
解及水溶解的過程,將製程所產生的廢氣,利用特殊設計的一個反應室,反應成
粉末或是反應成溶解於水中的物質,再經過後段之完全有效處理才排放至廠務中
央處理系統,所處理的廢氣,包含半導體廠、 TFT-LCD 廠、LED廠、太陽能廠
…等所使用的特殊氣體。
CVD:SiH4,NF3,WF6,B2H6,C3H6,TEOS,TDMAT,PDMAT,TMP,TMB,TEB,
TEPO,etc.
Diffusion:SiH4,DCS,TCS,LTO520,B2H6,ClF3,NH3,F2H2,etc.
Etch Process:CxFy,HBr,SiCl4,Cl2,BCl3,etc.
Advantage:
SGA-310B/SGA-310BS/SGA-310BSU處理流量1000LPM,含NF3處理量300LPM .
Pre-wet scrubber design,high removal efficiency.
Pre-heating design,high destruction efficiency.Electric heater type gas abatement system.
Perfect abatement efficiency for flammable &water soluble gases
Minimizing moisture vapor exhaust
Longer maintains cycle .Simple operation and easy maintenance .
Relatively lower operation cost(Longer life heater easy to PM)
Long PM cycles and short PM working time.Simple disassembly of key parts ensures high maintenance performance.
Minimal initial costs.
SEMI-S2 certified
SGA-310BSU/SGA-310B are suitable for PFC abatement for CVD process,etc.,  specially for NF3
Partition plate  type chamber design, improve waste gas retention time
Corrosion and Accumulation Prevention System - Use better material against corrosion for chambers and heaters - Prevent corrosion and powder accumulation from a structural approach - Create a nitrogen curtain to prevent inflow of H2O, which is the main cause of HF generation
-Special system with high corrosion resistance.
- Anti-corrosion material design,high corrosion resistance structure,long operation life than other competitor.
Efficient decomposition of dangerous and toxic gas by thermal oxidation. We use electric heaters for thermal oxidizing decomposition. It is safe and secure.
Comprehensive safety consideration.Safe and compact design . This series is safely designed for malfunction and safety warnings. It has a compact design for the front and back scrubbers, reactor and other necessary functions.
Special cooling design to prevent powder from accumulating.
Low fresh water usage
Low running cost . Uses only electricity and water, therefore it is easy to manage, making it possible to reduce running cost dramatically.  
Environmental friendly . Does not use fossil fuel, therefore there is no CO2 emission and thermal energy waste. It is an environmentaly friedly machine.
Install anywhere, including a clean room.
Suitable for handling deposition gas with a comparably low decomposition temperature.
Specifications and performance have been specifically designed for use with PE-CVD/PVD processes.
Minimum footprint and height.
Special air currents increase heat transmission, accelerating the gas abatement rate.
Uses ambient air for complete oxidation.
User friendly interface.
Easily scaled up for large gas flow systems .
Thermal Oxidation is an effective flexible abatement solution for effluent gas abatement.
 Managing the particles can be at integrated at point-of-use in the system or scaled up to a facility system.
Flexible customer design service.The customized design to meet the specific application.
The most advanced soft touch screen control system.
Quick PLC control for customer satisfaction
CMS(central monitor system) to observe and easily control of each gas scrubber.(Option)
Long gas residual time for high efficiency.
Bypass 設計,PM不停機(Option)
100% parts stock support in local
Technical support local directly
Steam Injection for F2 Abatement – designed to treat NF3 microwave clean processes
Form balanced heating zone to maximize process efficiency
Increase efficiency for soluble gas and power processing
Top down gas flow structure:Minimizing powder buildup
NOx free system
Simple maintenance through monitoring system
Operation of heaters using delta wiring :Operation of equipment  even in case of individual heater fail
Dynamic Oxidation is the most cost effective abatement solutions for pyrophoric gas abatement.
 IPI has been a pioneer in the development of pyrophoric gas abatement technologies 1990. Large flows of pyrophoric gases like SiH4 are used extensively in Semiconductor and Thin Film Solar manufacturing processes.
Dynamic oxidation provides one of the most reliable abatement methods at the lowest capital and operation cost.
Managing the particles can be at integrated at point-of-use in the system or scaled up to a facility system.
 The dynamic oxidation units can be fitted with a mechanical filter , no filters (Cyclone) or water scrubber to handle any water soluble gases.
Dynamic oxidation is a highly effective method to abate pyrophoric effluent gases.
A place where reactions are forced to occur.
Achieves high conversion efficiencies without active burning or added heat, by forced turbulent mixing of the pyrophorics with large quantities of air.
Each pyrophoric gas molecule undergoes numerous collisions with oxygen molecules increasing the probability of reaction to 100% and eliminating the hazards from the effluent stream.
同處理量下,外形尺寸比日本及國產品牌小,省空間.設備小型精巧,佔地面積小
無需燃料配管,初期設置成本低
僅使用電與水就可進行安全處理,低操作成本
比一般瓦斯燃燒式機種節省耗材成本,也不會有燃燒後產生二氧化碳的問題。其均溫性佳,處理效率較高
充分利用反應熱能之設計,耗能低
耗品耗件便於更換設計,容易維護
前段水洗先處理酸鹼氣體,增加氣體除去效率,延長加熱腔體壽命,後段水洗再處理酸鹼氣體及粉塵
兩段式加熱,延長氣體停留,增加氣體破壞效率,處理效率佳
可有效處理NF3(SGA-310BSU/SGA-310BS/SGA-310B/SGA-310BSUE/SGA-310BSUA/ITS-1000K/ITS-2000K-ITS-3000K)
環保功能設計, IDLE MODE省水省電省氣優於日本及國內外任何品牌 N2,CDA,Water saving function.
水氣分離器,可降低出口水氣,減少管路積水
經SEMI S2相關安全認證運行穩定安全的國際化標準設備
管路及腔體獨家使用最抗腐蝕材質,延長使用壽命,比使用CFRP環保
週延的安全考量,操作容易,Interlok安全連鎖設計,確保安全
儘量以前門及後門即可服務方式之設計,操作容易,低操作成本
智慧型電子控制系統。
作業溫度650~900度,可依氣體種類設定,有效處理廢氣。
智慧型線上故障排除系統。
廣泛使用在 CVD,PVD,ETCH,Diffusion,Solar cell 等製程。
超精密之安全機制在機台各個重點位置皆有安裝即時 ON-Line 訊號點。
人性化機台之操作設計保護相關工作人員之安全性及便利性。
保養維護PM的週期長,定期巡檢PM的時間約 0.5~1小時,不影響製程。
設有可依客戶需求設計之廢氣處理入口端。
處理量可依客戶需求設計:50LPM~2000LPM。
客製化服務
零件供應充足
到廠技術服務
選購設備:自動加藥系統設計(延長PM時間,節省人工處理困擾)/CMS中央遠端監控系統/Auto-Bypass自動切換系統/氣體偵測器/出口端風車/加熱槍及加熱帶/水質酸鹼測量供應系統
處理流量可依客戶需求進行客製化設計Capacity:100LPM~2000LPM
TEOS.POLY.Nitride.TI-Nitride.Hydrid大量粉塵特殊設計機型:ITS-1000K/ITS-2000K/ITS-3000K
刮刀設計適用機型:ITS-1000K/ITS-2000K/ITS-3000K